Copper Powder, Super Fine, Spherical

Copper Powder CU112SP

CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products. Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron. HTS Code: 7406.10.0000 NMFC: 30743 CAS: 7440-50-8. Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster, dry-wall, paint, adhesives and grout. Also used in 3D printing process known as Selective Powder Deposition (SPD). Old product code: CU155A. Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.

Product Specifications

Applications and Benefits:

• Cold casting and metal clay
• 3-D printer filaments and Selective Powder Deposition (SPD)
• Green/blue patina and rust effect creation
• Anti-mold additive for concrete, plaster, dry-wall
• Conductive filler in paint, adhesives, and grout

Caution:

Pure copper powders may not show conductivity when tested with a multimeter due to low test voltage or weak interparticle contact. Conductivity improves with higher voltage, compaction, or use in pastes.