Copper Powder, Fine, Spherical

CU118SP Copper Powder, Fine, Spherical

CU118SP is a fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products. Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron. Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster, dry-wall, paint, adhesives and grout. Also used in 3D printing process known as Selective Powder Deposition (SPD). Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.

Product Specifications

Applications and Benefits:

• Cold casting and metal clay formulations
• 3-D printer filaments and Selective Powder Deposition (SPD)
• Green/blue patina and rust effect in decorative finishes
• Mold prevention in concrete, plaster, and dry-wall
• Conductive filler for paint, adhesives, and grout

Caution:

Pure copper powders may not display electrical continuity with a multimeter due to low voltage or weak interparticle contact. Conductivity improves with compaction, higher voltage, or when used in paste form.