Copper Powder, Fine, Spherical

Copper Powder, Fine, Spherical

CU118SP Copper Powder, Fine, Spherical. Fine, high density, high purity spherical copper powder designed to provide high heat conductivity and electrical conductivity properties. Specification guarantees that at least 80% of particles are smaller than 44 micron (passing 325 mesh). Typical analysis shows approximately 88% below 44 micron, with most particles between 16 micron and 28 micron. Copper purity is over 99.5%, hydrogen loss less than 0.7%, and apparent density ranges from 4.5 to 5.5 g/cc. Applications include cold casting, 3-D printer filaments, metal clay, sintering, green/blue patina and rust effect finishes, mold prevention in concrete, plaster, dry-wall, paint, adhesives, and grout. Also used in Selective Powder Deposition (SPD) 3D printing processes. Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This may be due to low test voltage or weak interparticle contact. Conductivity improves at higher voltages, when compacted, or when mixed with oil or resin to form a paste.

Product Specifications

Applications and Benefits:

• Cold casting and metal clay formulations
• 3-D printer filaments and Selective Powder Deposition (SPD)
• Sintering applications
• Green/blue patina and rust effect decorative finishes
• Mold prevention in concrete, plaster, and dry-wall
• Conductive filler for paint, adhesives, and grout

Caution:

Pure copper powders may not display electrical continuity with a multimeter due to low voltage or weak interparticle contact. Conductivity improves with compaction, higher voltage, or when used in paste form. Refer to the Product Data Sheet (PDS) for detailed handling and safety information.