-
CU165Copper Powder 99.3%, General Purpose, 150 Mesh$39 - $1950CU23HPCopper Granules, 20 Mesh$45 - $2200CU7005FCopper Powder, Flaked, Waxed, Pigment$27 - $2900CUPDR
CU301-E: Copper Powder 99.8%
Safety Data Sheet for Copper PowderElectronic grade Copper powder, high purity, water attomized, hydrogen reduced ultra fine copper powder with spheroidal particles. Higher conductivity. Lower Density.
May be used for metal injection molding as well as other applications were the conductivity of product is important.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8Note: Pure copper powders do not show continuity or conductivity by a multimeter. I think there are two reasons for that. One is the low voltage used for the test. The other is lots of air and weak contacts between the particles. They will show conductivity with higher voltage, when they are compacted and when they are mixed with some oil or resin to form a paste.
Key Features
- 99.8% pure copper
- Ultra-fine, spheroidal particles
- High conductivity and lower density
- Suitable for metal injection molding
- Effective in electronic applications
Product Specifications
Purity 99.85% Particle Size -325 Mesh Density 2.97 g/cc Application Metal Injection Molding, Electronics Typical Analysis: Copper: 99.85%
Hydrogen Loss: 0.19%
Apparent Density: 2.97 g/cc
SIEVE ANALYSIS
60 MESH: 0%
-60/ 80 MESH: 0%
-80/ 100 MESH: 0%
-100/ 140 MESH: TR
-140/ 200 MESH: TR
-200/ 325 MESH: 0.6%
-325 MESH: 99.4%Similar Products
- High purity, sintering silver powder
- Fine nickel powder, electronic applications
- Ultra-fine aluminum powder, high conductivity
- Spherical zinc powder, lower density
- Conductive graphene powder, versatile use
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for electronics manufacturers, R&D labs, and specialists in conductive materials.Recommended for:
- Thick and Thin Film pastes
- Capacitor Chips
- End cap Terminators
- Conductive Inks, paints and pastes
- Injection Molding
- Electronics
- Thermal management
- EDM Electrodes
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
- Copper Powder, Super Fine, Spherical
- Copper Powder, Fine, Spherical
- Copper Granules, 16 Mesh
- Copper Powder 99.5% - 99.9%
- Copper Powder 99.3%, General Purpose, 150 Mesh
- Copper Granules, 20 Mesh
- Copper Powder, 99.5%, Mesh 100
- CU41, Copper Powder, Mesh 40 (Coarse)
- Copper Powder, Flaked, Waxed, Pigment
- Copper Powder- Granular- Mixed Grains
- Nickel Pellets, Electrolytic Grade
- Copper Filings- Granular- Mixed Grains
- Copper Powder 99 %, Mesh 200
- Copper Granules, 35 Mesh
-
Start Download
SDS_Copper_Powder.pdf
Fast Checkout