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Copper Powder 99.8%, Electronic Grade, Mesh 325

Ultra fine copper powder with spheroidal particles for high conductivity applications.
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CU301-E: Copper Powder 99.8%

Safety Data Sheet for Copper Powder

Electronic grade Copper powder, high purity, water attomized, hydrogen reduced ultra fine copper powder with spheroidal particles. Higher conductivity. Lower Density.
May be used for metal injection molding as well as other applications were the conductivity of product is important.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8

Note: Pure copper powders do not show continuity or conductivity by a multimeter. I think there are two reasons for that. One is the low voltage used for the test. The other is lots of air and weak contacts between the particles. They will show conductivity with higher voltage, when they are compacted and when they are mixed with some oil or resin to form a paste.

Key Features

  • 99.8% pure copper
  • Ultra-fine, spheroidal particles
  • High conductivity and lower density
  • Suitable for metal injection molding
  • Effective in electronic applications

Product Specifications

Particle Size-325 Mesh
Density2.97 g/cc
ApplicationMetal Injection Molding, Electronics
Typical Analysis:Copper: 99.85%
Hydrogen Loss: 0.19%
Apparent Density: 2.97 g/cc
60 MESH: 0%
-60/ 80 MESH: 0%
-80/ 100 MESH: 0%
-100/ 140 MESH: TR
-140/ 200 MESH: TR
-200/ 325 MESH: 0.6%
-325 MESH: 99.4%

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Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for electronics manufacturers, R&D labs, and specialists in conductive materials.

Recommended for:

  • Thick and Thin Film pastes
  • Capacitor Chips
  • End cap Terminators
  • Conductive Inks, paints and pastes
  • Injection Molding
  • Electronics
  • Thermal management
  • EDM Electrodes
  • Thermal Sprays
  • Sintered alloys/ products
  • Brazing/ soldering paste


  • Availability: In Stock
  • Model: CU301E
  • Brand: ChemicalStore