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High-purity, high-density spherical copper powder for enhanced conductivity and versatility.
CU279 Copper Powder 99 %, Mesh 200
CU279 Copper Powder 99 % Mesh 200 is a premium copper powder known for its high purity and unique properties. Produced through a water atomization process, it has irregular particles and clusters, offering a lower density. This powder is essential in various industries for its purity and conductivity, serving in applications like diamond wheel fabrication, sintering, and chemical reactions. It's also utilized in making conductive inks, paints, pastes, and as an element in thermal management systems.
Key Features
- High purity level of 99.3%
- Irregular particle shape for versatile applications
- Water-atomized and hydrogen-reduced
- Applicable in conductive inks and thermal management
- Effective in sintering and diamond wheel fabrication
Product Specifications
| Copper Purity | 99.3% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.6 - 2.8 g/cc |
| Sieve Analysis | 100 MESH: Trace 140 MESH: 1% Max 200 MESH: 3% Max 325 MESH: Balance -325 MESH: 90% Min |
Similar Products
- Fine iron powder, water-atomized, hydrogen-reduced
- Atomized aluminum, high-purity, mesh 200
- Nickel powder, irregular particles, conductive
- Brass powder, atomized, sintering applications
- Bronze powder, spherical, thermal uses
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Industrial Manufacturers, Chemical Engineers, Metal Fabricators, Research Laboratories, Electronics Manufacturers
- Thick and Thin Film pastes
- Conductive Inks, paints and pastes
- Injection Molding
- Thermal management
- EDM Electrodes
- Antifouling Paint
- Thermal Sprays
- Sintered alloys/ products
- Brazing/ soldering paste
For MSDS Go to Downloads TabCU118SP Copper Powder, Fine, Spherical
Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features:
- High-purity, high-density spherical copper powder
- Provides high heat conductivity and electrical conductivity
- Suitable for various applications, including cold casting, 3-D printer filaments, metal clay, sintering, green/blue patina and rust effect, preventing mold in concrete, plaster, dry-wall, paint, adhesives, and grout
- Used in the 3D printing process known as Selective Powder Deposition (SPD)
- Particle size distribution with 88% of particles smaller than 44 micron
Product Specifications:
| Copper Purity | Over 99.5% |
| Hydrogen Loss | Less than 0.7% |
| Apparent Density | 4.5-5.5 g/cc |
| Typical Analysis | Copper > 99.5% Hydrogen Loss < 0.7% Apparent Density, g/cc: 4.5 - 5.5 Passing mesh 325 (44 micron): 80% ~ 88% |
Similar Products:
- Ultra-Fine Copper Powder
- High-Purity Copper Foil
- Copper Wire
- Copper Rod
- Copper Sheet
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for enhanced conductivity and versatility applications, including cold casting, 3-D printing, metal clay, and more.
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